• Lead schematic capture and layout of complex multilayer PCBs for high-speed wireline interfaces (10G/25G/40G).• Design and simulate differential pairs, impedance-controlled traces, and high-frequency signal paths.• Develop PoE and power delivery circuitry compliant with 802.3af/at/bt standards.• Perform SI/PI simulations and coordinate board-level validation using oscilloscopes, VNAs, and test fixtures.• Ensure compliance with EMI/EMC standards and contribute to product certifications.• Collaborate with manufacturing partners on PCB stackups, fabrication specs, and assembly guidelines.Cross-Functional Collaboration• Work closely with RF, mechanical, and software engineers to ensure seamless hardware-software integration.• Assist in hardware bring-up, system integration, and field debugging.• Generate BOMs, test procedures, layout guidelines, and hardware release documentation.• Contribute to design-for-manufacturability (DFM) and design-for-test (DFT) practices.
• Bachelor’s or Master’s degree in Electrical Engineering or a related field.• 3+ years of experience in high-speed PCB design and hardware development.• Expertise in signal integrity, PoE design, and Ethernet PHY interfaces (SFP+, QSFP, etc.).• Proficiency with ECAD tools (Altium Designer, KiCAD, or Cadence Allegro).• Experience with lab equipment (oscilloscopes, logic analyzers, spectrum analyzers).• Familiarity with embedded systems and digital hardware design.• Experience with mmWave systems or RF is a plus but not required.
